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Wed, 27 Sep 2006 6:00:00 PDT
SAN JOSE, CA (MARKET WIRE) AMD (NYSE: AMD) has licensed Ultra-Flat Package Technology from MTBSolutions (MTBS). "The MTBSolutions Ultra-Flat Package Technology is a potentially enabling technology for technology requirements that include multi-core chip size, high performance, thermal requirements, and high bandwidth I/O that require scalable solutions," said Raj N. Master, AMD Senior Fellow and flip-chip packaging expert.
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